Toshiba Launches New Small Photorelays Rated for 135°C High-Temperature Operation

 Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced the release and immediate volume shipment of four new voltage-driven photorelays: TLP3407SRB, TLP3412SRB, TLP3412SRHB, and TLP3412SRLB. These photorelays, housed in a compact S-VSON4T package measuring 1.45 × 2.0 mm, are designed to operate reliably at high temperatures up to 135°C, surpassing the previous maximum rating of 125°C.

With the growing demand for electrification and autonomous driving technologies, automotive semiconductors require high-density packaging and must function under elevated temperature conditions. Correspondingly, reliability testing equipment such as testers, burn-in devices, and probe cards must also endure high temperatures. Toshiba’s new photorelays are optimized to meet these rigorous requirements by integrating built-in resistors, eliminating the need for external components and thus reducing mounting board space.

These advancements make the new photorelays especially suitable for automotive semiconductor testers, probe cards, and burn-in equipment where high-temperature operation and space efficiency are critical.

Toshiba remains committed to expanding its lineup of components that support high-temperature environments to contribute to the evolving needs of the automotive and semiconductor industries.